Recessed-channel FeFET

Footprint and lateral gate length are fixed at 20 nm. Only the recess depth changes. Watch the channel path, the HZO grain count and how far apart the "0" and "1" threshold distributions sit.

Cross-section

Threshold distributions across many cells

L_eff
HZO grains per cell
σ(V_t)
DIBL
3σ margin
Verdict

Model: L_eff = L_g + 2·max(0, d − x_j) with x_j = 5 nm. Grains N = L_eff·W/g² (W = 30 nm, g = 10 nm). σ(V_t) = 0.9 V/√N. DIBL = 600·exp(−L_eff/16 nm) mV/V. Memory window 1.8 V, V_R = 1.2 V. Margin = MW − 6σ − DIBL·0.5 V. These are scaling laws for intuition, not calibrated TCAD. Corner field crowding, sidewall interface traps and orientation-dependent HZO texture are not included.